Performance of 3rd Generation Locally Available Chemical Admixtures in the Production of SCC
Abstract
Increasing trend in urbanization and industrialization has necessitated production of high rise buildings with an innovation to make an optimized use of reduced available land in thickly populated areas, which is not possible by standard conventional concrete. Such a different concrete can be created only through different types of admixtures, which when added at various stages of concrete production yield required properties without scarifying the durability and economy of the structure. A proper mix design of self-compacting concrete (SCC) gives improved properties required in fresh state as well as in hardened state thus enhancing the durability of the structure through good bonding between concrete and steel apart from other factors. Present paper gives an outline of the fundamental rheological properties such as flow-ability, passing-ability and stability of self -compacting concrete in fresh state using variety of the locally available chemical admixtures related to 1st, 2nd and 3 rdgenerations from various chemicals supplying outlets. ASTM-test methods along with ACI, EFNARC and RILEM specifications and guidelines were followed throughout the experimentation process. It was observed that 3rd generation chemical admixtures gave better performance compared to 1 st and 2nd generation admixtures. Flow-ability and passing-ability for the produced concrete were found to be improved by an average of more than 25%. SCC produced was highly stable showing improvement in compressive strength by average of 30%. All this can be attributed to the long chain molecular structure of the Poly-Carboxylate Ether (PCE)in 3rd generation chemical admixtures helping produce highly fluid yet a stable concrete.References
Y.A. Cengel, “Heat Transfer: A Practical Approach”, Second Edition, McGraw-Hill, 2003.
T.Y. Lee, B. Chambers, M. Mahalingam, “Application of CFD technology to electronics thermal management”, Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging IEEE, Vol. 18, Issue: 3, pp. 511 – 520, August 1995.
K. Ramakrishna, T.Y. Lee, J. Hause, B. Chambers, and M. Mahalinguam, “Experimental evaluation of thermal performance and cooling enhancements to a handheld portable electronic system, in process, enhanced and multiphase heat transfer”, A Festschrift for A. E. Bergles, Proc. of an A. E. Bergles Symposium held at Georgia Institute of Technology, Atlanta, pp. 217-226, Begell House, Inc., New York, NY, 1997.
J.R. Culham, M.M. Yovanovich, “Non-Iterative technique for computing temperature distributions in flat plates with distributed sources and convective cooling”, ASME/JSME Thermal Engineering Joint Conference, Honolulu, HI, Vol. 3, pp. 403-409, 1987.
M. Arik, S. Brzozowski, M. Nagulapally, and J. Glaser, “Thermal design and optimization of harsh environment power electronics in natural convection heat transfer”, ASME Summer Heat Transfer Conference, HT2003-47015, Las Vegas, Nevada, 2003.
V. Eveloy, P. Rodgers, M.S.J. Hashmi, “Numerical heat transfer predictive accuracy for an in-line array of board- mounted plastic quad flat back components in free convection”, Journal of Electronic Packaging, Vol. 127, Issue: 3, pp. 245-254, 2004.
K.J. Negus, M.M.Yovanovich, “Thermal analysis and optimization of convectively cooled microelectronic circuit boards”, AIAA/ASME 4th Thermophysics and Heat Transfer Conference, Boston, Vol. 57, pp. 167- 176, 1986.
F. Sarvar, D.C. Whalley, “Thermal design of high power semiconductor packages for aircraft systems”, Journal of Electronics Manufacturing, Vol. 9, Issue: 4, pp. 269-274, 1999.
A. Jamnia, M. Dekker, “Practical guide to the packaging of electronics, thermal and mechanical design and analysis”, Second Edition CRC Press, 2008.
D.S. Steinberg, “Cooling Techniques for Electronic Equipment” Second Edition New York: John Wiley & Sons, 1991.
E. Kreyszing, “Advanced Engineering Mathematics” Eighth Edition New York: John Wiley & Sons, 1999.
S.A. Bhatti, N.A.Bhatti, “A first course in Numerical Analysis with C++”, Fourth Edition, May 2002
